Investigation of the effect of thermal cycling on the device performance of YBa2Cu3O7-? DC-SQUIDs

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dc.contributor.authorAvci I.
dc.contributor.authorAlgul B.P.
dc.contributor.authorBozbey A.
dc.contributor.authorAkram R.
dc.contributor.authorTepe M.
dc.contributor.authorAbukay D.
dc.date.accessioned2019-10-27T08:37:12Z
dc.date.available2019-10-27T08:37:12Z
dc.date.issued2007
dc.departmentEge Üniversitesien_US
dc.description.abstractWe investigated the effect of thermal cycling on the operational performance of YBa2Cu3O7-? (YBCO) direct current superconducting quantum interference devices (DC-SQUIDs) fabricated onto 24°SrTiO3 (STO) bicrystal substrates. The devices under investigation consist of directly coupled DC-SQUID magnetometer configurations. Thin films having 200nm thicknesses were deposited by dc-magnetron sputtering and device patterns were made by a standard lithography process and chemical etching. The SQUIDs having 4?m-wide grain boundary Josephson junctions (GBJJs) were characterized by means of critical currents, peak-to-peak output voltages and noise levels, depending on the thermal cycles. In order to achieve a protective layer for the junctions against the undesired effects of thermal cycles and ambient atmosphere during the room temperature storage, the devices were coated with a 400nm thick YBCO layer at room temperature. Since the second layer of amorphous YBCO is completely electrically insulating, it does not affect the operation of the junctions and pick-up coils of magnetometers. This two-layered configuration ensures the protection of the junctions from ambient atmosphere as well as from the effect of water molecules interacting with the film structure during each thermal cycle. © IOP Publishing Ltd.en_US
dc.identifier.doi10.1088/0953-2048/20/10/008
dc.identifier.endpage949en_US
dc.identifier.issn0953-2048
dc.identifier.issn0953-2048en_US
dc.identifier.issue10en_US
dc.identifier.scopusqualityQ1en_US
dc.identifier.startpage944en_US
dc.identifier.urihttps://doi.org/10.1088/0953-2048/20/10/008
dc.identifier.urihttps://hdl.handle.net/11454/27496
dc.identifier.volume20en_US
dc.indekslendigikaynakScopusen_US
dc.language.isoenen_US
dc.relation.ispartofSuperconductor Science and Technologyen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.titleInvestigation of the effect of thermal cycling on the device performance of YBa2Cu3O7-? DC-SQUIDsen_US
dc.typeArticleen_US

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