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    Investigation of micro-milling process parameters for surface roughness and milling depth
    (Springer London Ltd, 2011) Saklakoglu, Ibrahim Etem; Kasman, Sefika
    The main objective of this study is to investigate the micro-milling performance of the AISI H13 with different process parameters namely laser power, scan speed, frequency, and fill spacing using 30W fiber laser marking machine and to find the optimal operation conditions for minimum surface roughness and maximum milling depth. The 108 different combinations occurred with the interaction of each level of the parameters used in this study. Therefore, the main contribution of this paper to the related literature is that it produces new evidence regarding the effects of the multi-scan times on both surface roughness and milling depth. The experimental results are showed that 0.03 mm of fill spacing, the highest scan speed (800 mm/s), lowest frequency (20 kHz), and laser power (60%) produced better surface roughness, which is 1.75 mu m. The deeper cavity on the geometry is obtained under the experimental combination as 200 mm/s of scan speed, 0.02 mm of fill spacing, 60% of laser power, and 40 kHz of frequency, which is 195 mu m. The regression analysis was used to develop a mathematical model and determine the effect of process parameters on the surface roughness and milling depth. The results of subsequent tests verifies regression models.
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    Öğe
    Surface morphology and tribological behavior of AlSi10 alloys treated by plasma immersion ion implantation for automotive applications
    (Elsevier Science Sa, 2009) Saklakoglu, Ibrahim Etem
    Plasma immersion ion implantation (Pill) was used to implant nitrogen into Al at a temperature in the range of 320-520 degrees C. AIN phase was observed for temperatures above 450 degrees C, whereas no AIN detected by XRD diagnosis at temperatures below 380 degrees C. It was also observed that there was no effective increase in hardness of the material, but some wear resistance due to formation of AIN. (c) 2008 Elsevier B.V. All rights reserved.